Royole's next foldable phone is much better at bending

Ruben Fields
March 27, 2020

Liu revealed the new phone will have a Snapdragon 865 chipset with 5G modem.

Last year, at CES 2019, Royole launched FLEXPAI, the world's first foldable phone and somehow started a trend on the smartphones market, which bigger companies soon followed. The Flexpai 2 will certainly likewise have LPDDR5 RAM as well as UFS 3.0 storage space, yet without pointing out ability as the phone's launch is still a while away - in Q2 2020 - as well as information could transform.

In the conference, Royole officials showcased the display, which was the highlighting part of the event. Unfortunately, details regarding its battery capacity are still unknown, but that is to be expected since there is still time for the device officially launches. According to the authorities, the panel endured 200,000+ flexes without receiving any kind of damages. The new panel features almost 100 micro-nano materials to improve the strain recovery and “layer peeling” which is the bubbles and creases you feel when the panel is unfolded.

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According to Royole, the brand-new Cicada Wing will certainly have 1.3 x much better shade range as well as 500 x much better comparison than a premium LCD. The handset will also feature a unique custom designed display driver that is integrated in the circuit chip. Today, the manufacturer finally unveiled the FlexPai 2, which is equipped with a tougher and more vibrant flexible display, along with a new robust hinge to keep everything together. This may be indicative of ZTE using Flexpai's technology, integrating the display in its own foldable smartphone series. Thus, take it with a grain of salt.

Chances are the FlexPai 2 won't be the only device to leverage the third-generation Cicada Wing FFD.

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